NPM-GP/L Paste Tester

Board switching time: 6.5 seconds (for a board size of 350300mm)
Supports automatic solder paste dispensing
Maximum board size: 510510mm
Choice of squeegee sizes: 530mm, 480mm, 370mm, and 270mm

PANASONIC NPM-WX Mounter

．Four types of placement heads (16/8/4/3) are available, allowing for a versatile pick-and-place machine suitable for high-speed or general-purpose applications
．Supports PCB sizes up to 750*610mm, with optional dual-track mode
．Output capacity of up to 86,000 CPH (based on optimal conditions)
．Supports components as small as 03015 (metric), with a maximum of 136 component types simultaneously
．Feeding options include tray, automatic tray, stick, and bulk

NPM-W2 Paste Tester

Multifunctional production system
Choice of 16/12/8/3 types of mounting heads, compatible with high-speed or universal mounter for multi-functional pick-and-place machine.
Maximum board size support up to 750*550mm, with optional dual-track mode.
Output capacity of up to 84,000 CPH. (based on optimal conditions of our company)
Supports minimum component size of 03015 (metric), capable of simultaneously accommodating up to 120 types of components.
Evolution of 16 and 8 mounting heads provides a broader range of component compatibility.

REHM VisionXC Nitrogen Reflow Oven

An ideal compact system that encompasses all essential technological features within a minimal footprint, ensuring high-quality component production even in small batches.

REHM VisionXP+(Vacuum&Non-Vacuum) Reflow Oven

Unique technological advantages, high-efficiency equipment, reducing operational costs; according to statistics, using VisionXP+ during production can save up to 20% of energy consumption, resulting in an average reduction of 10 tons of CO2 emissions per year.

REHM CondensoXC Gas Welding

CondensoXC

REHM CondensoX-Line Gas Welding

REHM CondensoX-Line

REHM Condenso smartline Gas Welding

Condenso smartline

Nitrogen Generator

Automatic Inspection X-Ray TI-X700i (Online)

テクノホライゾン株式会社

The TI-X700i X-ray inspection equipment can be used to control the quality of bonding conditions in flip-chip mounting, which is essential for high-density mounting of semiconductor packages, and to improve manufacturing processes.

Automatic Inspection X-Ray TI-X500s(Offline)

テクノホライゾン株式会社

The TI-X500s inspection system has an automated inspection function with high levels of accuracy, repeatability and reproducibility, as well as defect analysis function. The system is widely adopted in the SMT component placement processes and semiconductor manufacturing processes.

X-Ray Inspection

X-ray inspection machines are suitable for non-destructive testing in most electronic industries, utilizing X-ray penetration. The core component, the X-ray tube, adopts the HAMAMATSU brand from Hamamatsu. It offers non-destructive testing with defect detection capabilities below 5 microns, and the flat-panel detector can rotate up to 60 degrees, providing high-definition imaging with a system magnification of up to 1000 times.

X-RAY Parts Counter

Based on X-ray technology combined with machine vision and automation, our patented product offers fully automated operations including autonomous material feeding, barcode scanning, point counting, and material dispensing. This significantly enhances management accuracy and efficiency for production departments while greatly reducing labor costs.

ER-7000 AT Automatic PCB Router Machine(IN LINE)

Equipped with a high-precision CCD vision automatic alignment correction system, greatly improving cutting accuracy and work efficiency.